Eight successful test chips across four foundries
Eight successful test chips across four foundries. Our silicon-proven track record spans multiple tapeouts on TSMC, Intel, GlobalFoundries, and Samsung—demonstrating robust design portability and foundry flexibility that de-risks your supply chain.
Silicon proven from 16nm FinFET to Intel 18A. Validated performance across leading-edge nodes including 16nm, 22nm, and Intel’s most advanced 18A process—ensuring your eFPGA IP scales with technology roadmaps without architectural compromise.
Unmatched process portability for mission-critical designs. Synthesizable soft IP architecture eliminates hard macro lock-in, enabling seamless migration across foundries and nodes to meet ITAR requirements, address supply chain disruptions, and optimize for performance or power as your mission demands.